开料-内层湿膜-AOI-棕化-压合-钻孔-沉铜-全板电镀-图形转移-图电铜锡-蚀刻-绿油-字符-喷锡（无铅喷锡/沉金）-成型-测试-终检（-SOP/沉锡/沉银-终检）-FQA-包装-出货

PCB CUTTING---INNER LAYER--AOI-BROWN OXIDE-LAMINATION-DRILLING-PTH-PANEL PLATED-OUT LAYER DRY FILM-PATTEN PLATING-ETCHING-SOLDERMASK-SILKSCREEN-HAL(LF-HAL/IMM GOLD)-PROFILING-E-TEST-FQC(-OSP/IMM TIN/IMM SILVER-FQC)-FQA-PACKING-SHIPPING